Basic Info.
Model NO.
SW-PLC
Applicable Material
Metal
Type
Flat-Plate
Laser Classification
Fiber Laser
Engraving Method
Vector Engraving
Features
Auto-Positioning Cutting PCB
Workbench
High Precision Linear Motor and Marble Platform
Certificate
CE, FDA
Delivery
15 Working Days
Term
Fob Shenzhen
Transport Package
Standard Eexport Wooden Packing
Specification
1.5CBM
Trademark
SUPERWAVE LASER
Origin
China
Production Capacity
100sets/Month
Product Description
Laser Cutting and Routing Systems for The Depaneling of PCB, FPC | Supuerwave ®
Laser Depaneling is the most innovative and promising technique for cutting and separating printed circuit boards from the panel and is differentiated from the classic separation methods in particular by its flexibility and stress-free processing.
Features
1. High quality cutting edge of PCB & FPC: The narrow beam diameter of the laser enables precise and high quality processing of the PCB & FPC material.
2. Sress-free processing: Due to the non-contact process, Laser separates the printed circuit boards from the panel without any mechanical stress to the material.
3. Keep clean processing: In mechanical processes, such as milling, dust is generated during the manufacturing process, while Laser depaneling evaporates the material, and at the same time, Fume extraction device exhausts the cutting fumes and keep the boards clean.
4. Materials diversity: Superwave Laser Depaneling can process a wide variery of different substrate materials with ease by varying the process parameters.
1. High quality cutting edge of PCB & FPC: The narrow beam diameter of the laser enables precise and high quality processing of the PCB & FPC material.
2. Sress-free processing: Due to the non-contact process, Laser separates the printed circuit boards from the panel without any mechanical stress to the material.
3. Keep clean processing: In mechanical processes, such as milling, dust is generated during the manufacturing process, while Laser depaneling evaporates the material, and at the same time, Fume extraction device exhausts the cutting fumes and keep the boards clean.
4. Materials diversity: Superwave Laser Depaneling can process a wide variery of different substrate materials with ease by varying the process parameters.
Technical Data
| Laser model | SW-PCB | |||
| Laser power | 10W / 15W / 20W | |||
| Working Area | 200 x 300mm (Customization Accepted) | |||
| Laser wavelength | 355±15nm | |||
| Max diameter of Focus beam | 20μm | |||
| Repeatability | <=2μm | |||
| Laser pulse frequency | 40 kHz to 300kHz | |||
| File format | .Gerber/. dxf /.plt /.jpg, etc | |||
| Fiber cable core diameter | <=2KW | |||
| Cooling system | Water chiller | |||
| Power supply | AC220V/50-60Hz | |||
| Options | Air compressor / Fume Exhaustion | |||
Samples
